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Kester R520A lead free, organic acid, water solubl

Kester R520A lead free, organic acid, water solubl

Kester R520A lead free, organic acid, water solubl

SKU: KES P-R520A Category:

Product Information

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R520A

Kester R520A is a lead free, organic acid, water soluble solder paste formula specifically designed for use with the higher temperature Pb-Free alternative soldering alloys such as Sn96.5Ag3.0Cu0.5 (SAC Alloys). The solder paste exhibits long stencil life and tack time, while still delivering exceptional solderability to a wide variety of metallic substrates. R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electro-less Nickel (ENIG) boards.
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View Data Sheet (English)
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Product Specifications

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Viscosity: 2125 poise
Print Speed: Up to 6"/sec
Idle Time: 90 minutes
Tackiness: 30 grams
Metal %: 89.5%
Probeable: Yes
Reflow/ Atmoshperes: Air and nitrogen
Powder Size: -325/+500
Stencil Life: 8 hours
Tack Time: 8 hours
Liquidus ( C): See chart
Solidus ( C): See cha

IPC

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Silver Chromate: Pass
Classification: ORHO
SIR: Pass
Halide Content:
Copper Plate Corrosion: H
Copper Mirror: L


Part Numbers

Alloy Packaging
Sn96.5 Ag3.0 Cu0.5 500 gram jar
Sn96.5 Ag3.0 Cu0.5 600 gram cartridge
Sn96.5 Ag3.0 Cu0.5 1000 gram cartridge
Sn96.5 Ag3.0 Cu0.5 1400 gram cartridge
Sn96.5 Ag3.5 500 gram jar
Sn96.5 Ag3.5 600 gram cartridge
Sn96.5 Ag3.5 1000 gram cartridge
Sn96.5 Ag3.5 1400 gram cartridge

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